Verfahren zur Temporären Waferbindung und Dünnschichtwaferherstellungsverfahren

Details

Veröffentlichungs-Nr.

EP3038148

Aktenzeichen

EP15201534

Anmeldetag

21. Dezember 2015

Veröffentlichung

2. August 2017

Erteilung

2. August 2017

Rechtsraum

EP

IPC

H01L21/683C09J7/02B24B37/30

Abstract

A method for temporarily bonding a wafer to a support via a temporary bonding arrangement is provided. The arrangement is a composite temporary adhesive layer consisting of a non-silicone thermoplastic resin layer (A) which is releasably bonded to the wafer, a thermosetting siloxane polymer layer (B) laid thereon, and a thermosetting siloxane-modified polymer layer (C) releasably bonded to the support. The method comprises the steps of providing a wafer laminate having a thermosetting silicone composition layer (B') formed on the resin layer (A) which has been formed on the wafer, providing a support laminate having a siloxane-containing composition layer (C') formed on the support, joining and heating layer (B') and layer (C') in vacuum for bonding and curing the layers together.

Anmelder

Firma

Shin-Etsu Chemical Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete