Halbleiter-Chippackungsanordnung mit Verbesserter Wärmeableitungsleistung

Details

Veröffentlichungs-Nr.

EP3091573

Aktenzeichen

EP16161852

Anmeldetag

23. März 2016

Veröffentlichung

22. Februar 2017

Rechtsraum

EP

IPC

H01L25/16H01L25/10H01L23/538H01L23/34H01L23/50

Abstract

A semiconductor chip package assembly (1) includes a package substrate (200) having a chip mounting surface (200a); a plurality of solder pads (212) disposed on the chip mounting surface; a first dummy pad (211) and a second dummy pad (211) spaced apart from the first dummy pad disposed on the chip mounting surface; a solder mask (202) on the chip mounting surface and partially covering the solder pads, the first dummy pad, and the second dummy pad; a chip package (100) mounted on the chip mounting surface and electrically connected to the package substrate through a plurality of solder balls (250) on respective said solder pads (212); a discrete device (150)having a first terminal (151) and a second terminal (152) disposed between the chip package and the package substrate; a first solder (154) connecting the first terminal with the first dummy pad (211) and the chip package (100); and a second solder (154) connecting the second terminal (152) with the second dummy pad (211) and the chip package (100).

Anmelder

Firmen

MediaTek Inc.
MediaTek, Inc

Land

🇹🇼 Taiwan

Fachgebiete