Chip mit Aufgesetzten Strukturen

Details

Veröffentlichungs-Nr.

EP3095757

Aktenzeichen

EP16169401

Anmeldetag

12. Mai 2016

Veröffentlichung

5. Dezember 2018

Erteilung

5. Dezember 2018

Rechtsraum

EP

IPC

B81C1/00H01L23/64

Abstract

One example discloses a chip, comprising: a substrate (102, 202, 302, 602, 802); a first side of a passivation layer (206, 604, 804) coupled to the substrate (102, 202, 302, 602, 802); a device, having a device height and a cavity, wherein a first device surface is coupled to a second side of the passivation layer (206, 604, 804) which is opposite to the first side of the passivation layer (206, 604, 804); and a set of structures (108, 110, 214, 306, 410, 502, 504, 612, 614, 702, 812) coupled to the second side of the passivation layer (206, 604, 804) and configured to have a structure height greater than or equal to the device height.

Anmelder

Firma

ams International AG

Land

🇨🇭 Schweiz

Fachgebiete