Verfahren zur Übertragung einer Schicht aus einem Einkristallsubstrat
Anmelder: Soitec 🇫🇷
Details
- Veröffentlichungs-Nr.
- EP3098839
- Aktenzeichen
- EP16171740
- Anmeldetag
- 27. Mai 2016
- Veröffentlichung
- 4. März 2020
- Erteilung
- 4. März 2020
- Rechtsraum
- EP
- IPC
- H01L21/762H01L21/02
Abstract
The invention relates to a method for transferring a layer (11) from a single-crystal substrate, called donor substrate (1), onto a receiver substrate (2), comprising: - the supply of said single-crystal donor substrate (1), said substrate having a notch oriented in a first direction of the crystal and a weakness region (10) bounding the layer (11) to be transferred, - the bonding of the single-crystal donor substrate (1) onto the receiver substrate (2), the main surface (12) of the donor substrate opposite to the weakness region (10) with respect to the layer to be transferred (11) being at the bonding interface, - the detachment of the donor substrate (1) along the weakness region (10), said method being characterized in that the donor substrate (1) has, on the main surface (12) bonded to the receiver substrate (2), an array of atomic steps extending essentially in a second direction of the crystal different from said first direction.
Anmelder
- Firma
- Soitec
- Land
- 🇫🇷 Frankreich
Französischer Halbleiterhersteller mit Sitz in Bernin, spezialisiert auf Silicon-on-Insulator (SOI) Substrate. Patente decken Halbleitermaterialien und Waferbondtechnik ab.
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