Halbleiterbauelement und Verfahren zur Ansteuerung eines Halbleiterbauelements
Anmelder: Renesas Electronics Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP3109904
- Aktenzeichen
- EP16169787
- Anmeldetag
- 16. Mai 2016
- Veröffentlichung
- 22. Februar 2017
- Rechtsraum
- EP
- IPC
- H01L29/423G11C11/56H01L29/792H01L27/115G11C16/04G11C16/14G11C16/34
Abstract
A first potential and a second potential lower than the first potential are applied to a first end of a memory gate electrode part of the nonvolatile memory and to a second end of the memory gate electrode part, respectively, so that a current is caused to flow in a direction in which the memory gate electrode part extends, then, a hole is injected from the memory gate electrode part into a charge accumulating part below it, therefore, an electron accumulated in the charge accumulating part is eliminated. By causing the current to flow through the memory gate electrode part of a memory cell region as described above, Joule heat can be generated to heat the memory cell. Consequently, in the erasing by a FN tunneling method in which the erasing characteristics degrade at a low temperature, the erasing speed can be improved by heating the memory gate electrode part.
Anmelder
- Firma
- Renesas Electronics Corporation
- Land
- 🇯🇵 Japan
Japanischer Halbleiterhersteller mit Sitz in Tokio, spezialisiert auf Mikrocontroller, analoge Bauelemente und Halbleiterlösungen unter anderem für die Automobil- und Industrieelektronik.
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