Kupferplattierungsbadzusammensetzung

Details

Veröffentlichungs-Nr.

EP3141633

Aktenzeichen

EP15184663

Anmeldetag

10. September 2015

Veröffentlichung

2. Mai 2018

Erteilung

2. Mai 2018

Rechtsraum

EP

IPC

C25D3/38C25D7/00H05K3/18

Abstract

The present invention relates to aqueous acidic plating baths for copper deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and an additive obtainable by a reaction of at least one aminoglycidyl compound comprising at least one amino group which bears at least one glycidyl moiety and at least one second compound selected from ammonia and amine compounds wherein the amine compounds comprise at least one primary or secondary amino group with the proviso that the aminoglycidyl compound contains at least one polyoxyalkylene residue and / or the amine compound contains at least one polyoxyalkylene residue. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Anmelder

Firmen

MKS IP Association
Atotech Deutschland GmbH

Land

🇩🇪 Deutschland

Fachgebiete