Gehäuse für eine Integrierte Schaltung mit einem eine Übertragungsleitung Aufweisenden Interposer

Details

Veröffentlichungs-Nr.

EP3144967

Aktenzeichen

EP16189120

Anmeldetag

16. September 2016

Veröffentlichung

21. November 2018

Erteilung

21. November 2018

Rechtsraum

EP

IPC

H01L23/66H01L23/498H01P3/08H05K1/02H05K1/14H05K1/18H01L23/13H01L23/36

Abstract

In one embodiment, an integrated circuit package includes a package substrate, a printed circuit board, an interposer structure and a transmission line bridge interconnect within the interposer. The interposer structure, which includes multiple interposer layers, may be formed on a top surface of the package substrate. The printed circuit board may be coupled to the package substrate through the transmission line bridge interconnect. The transmission line may be formed on at least one of the interposer layers. The transmission line may be utilized to convey signals between the package substrate and the printed circuit board. The transmission line may be a stripline transmission line or a micro-strip transmission line. The transmission line may have a low parasitic inductance and implementation of the transmission line does not introduce large dimensional discontinuity throughout that signal pathway. The integrated circuit package may be part of a circuit system that includes external circuits.

Anmelder

Firma

Altera Corporation

Land

🇺🇸 USA

Fachgebiete