Verfahren zur Elektrischen Kontaktierung einer Beschichteten Leitung mit einer Schicht
Anmelder: Heraeus Deutschland GmbH & Co. KG 🇩🇪
Details
- Veröffentlichungs-Nr.
- EP3185363
- Aktenzeichen
- EP15202412
- Anmeldetag
- 23. Dezember 2015
- Veröffentlichung
- 12. Februar 2020
- Erteilung
- 12. Februar 2020
- Rechtsraum
- EP
- IPC
- H01R4/24H01R4/20// H01R13/03H01R24/58
Abstract
In general, the present invention relates generally to a process for electrically contacting a coated lead (100a). More specifically, the invention relates to a process, an electrically contacted lead and a medical device (50) comprising an electrically contacted lead (100d). The present invention relates to a process for electrically contacting a coated lead comprising the following steps: a. Providing a coated lead (100a) comprising an electrically conductive core (102) and an electrically insulating coating (101); b. Providing a via hole (103) in the electrically insulating coating (101) in order to expose a section of the electrically conductive core (102); c. Applying a first electrically conductive material (104) to the coated lead (100b) such that it contacts at least a part of the exposed section of the electrically conductive core via the via hole; d. Applying a further electrically conductive material (105) to the coated lead (100d) such that it contacts at least a part of the first conductive material (104).
Anmelder
- Firma
- Heraeus Deutschland GmbH & Co. KG
- Land
- 🇩🇪 Deutschland
Deutsches Technologieunternehmen mit Sitz in Hanau. Heraeus entwickelt Materialien und Lösungen in den Bereichen Edelmetalle, Sensorik, Medizintechnik und Werkstofftechnik.
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