Elektronische Vorrichtung
Anmelder: NXP B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP3193281
- Aktenzeichen
- EP16151489
- Anmeldetag
- 15. Januar 2016
- Veröffentlichung
- 13. November 2019
- Erteilung
- 13. November 2019
- Rechtsraum
- EP
- IPC
- G06K19/073H01L23/00G06K9/00H01L23/64
Abstract
According to a first aspect of the present disclosure, an electronic device is provided which comprises: a substrate; an integrated circuit; a layer of glue between the substrate and the integrated circuit; a set of driving electrodes coupled to the glue and to the integrated circuit; a receiving electrode coupled to the glue and to the integrated circuit; a counter electrode coupled to the glue and to the substrate; wherein the glue comprises conductive particles which electrically connect the receiving electrode, the counter electrode and at least a part of the set of driving electrodes, such that, if drive currents are provided to said set of driving electrodes, at least a part of the drive currents flows to the receiving electrode through the conductive particles and the counter electrode. According to a second aspect of the present disclosure, a corresponding method of manufacturing an electronic device is conceived.
Anmelder
- Firma
- NXP B.V.
- Land
- 🇳🇱 Niederlande
Niederländischer Halbleiterhersteller mit Sitz in Eindhoven. Entwickelt Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation, Sicherheit sowie industrielle Anwendungen.
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