Halbleiterbauelement, Temperatursensor und Leistungsversorgungsspannungsmonitor

Details

Veröffentlichungs-Nr.

EP3239673

Aktenzeichen

EP17168152

Anmeldetag

26. April 2017

Veröffentlichung

17. April 2019

Erteilung

17. April 2019

Rechtsraum

EP

IPC

G01K7/01G01K15/00

Abstract

According to one embodiment, a semiconductor device 1 includes a temperature sensor module 10 that outputs a non-linear digital value with respect to temperature and a substantially linear sensor voltage value with respect to the temperature, a storage unit 30 that stores the temperature, the digital value, and the sensor voltage value, and a controller 40 that calculates a characteristic formula using the temperature, the digital value, and the sensor voltage value stored in the storage unit 30, in which the temperature, the digital value, and the sensor voltage value stored in the storage unit 30 include absolute temperature under measurement of absolute temperature, the digital value at the absolute temperature, and the sensor voltage value at the absolute temperature.

Anmelder

Firma

Renesas Electronics Corporation

Land

🇯🇵 Japan

Fachgebiete