Halbleitermodul

Details

Veröffentlichungs-Nr.

EP3267477

Aktenzeichen

EP17178953

Anmeldetag

30. Juni 2017

Veröffentlichung

19. Dezember 2018

Erteilung

19. Dezember 2018

Rechtsraum

EP

IPC

H01L23/13H01L25/065H01L23/498

Abstract

A semiconductor module includes a wiring substrate and two semiconductor devices mounted on the wiring substrate. The semiconductor module includes a housing having a rectangular frame body including four side walls. The housing includes a beam that bridges first side walls. A bus bar includes two end portions, upright portions each extending from one of the end portions in the thickness direction of an insulating substrate, bent portions each extending continuously with one of the upright portions, and an extension extending continuously with the bent portions. A section of the extension is embedded in the housing.

Anmelder

Firma

Kabushiki Kaisha Toyota Jidoshokki

Land

🇯🇵 Japan

Fachgebiete