Verfahren zur Herstellung einer Berührungsempfindlichen Vorrichtung und Berührungsempfindliche Vorrichtung

Details

Veröffentlichungs-Nr.

EP3299944

Aktenzeichen

EP17020398

Anmeldetag

31. August 2017

Veröffentlichung

30. September 2020

Erteilung

30. September 2020

Rechtsraum

EP

IPC

G06F3/041B32B38/18

Abstract

A method for manufacturing a touch sensing device with minimized misalignment of the fast axes of two bonded substrates and suitable for mass production. The method includes the following steps 1) to 5). 1) Preparing a biaxially-stretched material film F. The material film F includes an available area F1 being an area in the widthwise direction and extends in the lengthwise direction. The available area F1 includes a first segment F11 and a second segment F12 that define different areas in the lengthwise direction. 2) Forming an electrode group on one of the first and second segment F11, F12. 3) Cutting a first piece P1 out of the material film F to make the first piece including the first segment F11. 4) Cutting a second piece P2 out of the material film F to make the second piece including the second segment F12. 5) Bonding the first segment F11 to the second segment F12 substantially maintaining orientations of the first and second segment F11, F12 as before the cutting.

Anmelder

Firma

Hosiden Corporation

Land

🇯🇵 Japan

Fachgebiete