Verfahren zur Herstellung einer Druckleiterplatte

Details

Veröffentlichungs-Nr.

EP3310137

Aktenzeichen

EP16193971

Anmeldetag

14. Oktober 2016

Veröffentlichung

27. Februar 2019

Erteilung

27. Februar 2019

Rechtsraum

EP

IPC

H05K3/28H05K3/34H05K3/38H05K3/46// H05K3/24

Abstract

A method for manufacturing a printed circuit board, comprising in this order the steps (i) providing a non-conductive substrate having on at least one surface - - a copper circuitry with a copper surface, wherein the copper surface is - chemically treated by (a) an oxidation and subsequent reduction reaction and/or (b) an organic compound attached to the copper surface, - a permanent, non-conductive, not fully polymerized cover layer covering at least partially said copper surface, (ii) thermally treating the substrate with the permanent, non-conductive, not fully polymerized cover layer at a temperature in the range from 140°C to 250°C in an atmosphere, which contains molecular oxygen in an amount of 100000 ppm or less, based on the total volume of the atmosphere, such that a substrate with a permanent, non-conductive cover layer is obtained, the cover layer being more polymerized compared to step (i), with the proviso: - that step (ii) is carried out after step (i) but before any metal or metal alloy is deposited onto the permanent, non-conductive, not fully polymerized cover layer, and - that in step (ii) the permanent, non-conductive, not fully polymerized cover layer is fully polymerized in solely one single thermal treating step, if the cover layer is a solder mask.

Anmelder

Firmen

MKS IP Association
Atotech Deutschland GmbH

Land

🇩🇪 Deutschland

Fachgebiete