Vertikale Komponentenhalterung

Details

Veröffentlichungs-Nr.

EP3313155

Aktenzeichen

EP17197067

Anmeldetag

18. Oktober 2017

Veröffentlichung

25. August 2021

Erteilung

25. August 2021

Rechtsraum

EP

IPC

H05K1/02H01L23/367H01L23/42// H05K3/30

Abstract

A circuit component arrangement (105) includes a base (102) and a plurality of circuit components (104) mounted to the base (102). A bonding agent (106) adheres the circuit components (104) in intimate contact to the base (102). The bonding agent (106) is disposed in a respective open channel (108) defined in an outward facing surface (110) of the base (102) in contact with each of the circuit components (104). A method of assembling a circuit component arrangement (100) includes temporarily fastening a plurality of circuit components (104) to a base (102). A bonding agent (106) is injected into a respective open channel (108) defined in the base (102) to adhere each of the plurality of circuit components (104) to the base. The plurality of circuit components (104) are unfastened from the base (102). Injecting a bonding agent (106) can include ceasing injection of bonding agent (106) upon appearance of bonding agent (106) in a window opening (118) in fluid communication with the open channel.

Anmelder

Firma

Hamilton Sundstrand Corporation

Land

🇺🇸 USA

Fachgebiete