Leistungshalbleitermodule mit Schutzbeschichtung

Details

Veröffentlichungs-Nr.

EP3336890

Aktenzeichen

EP17206860

Anmeldetag

13. Dezember 2017

Veröffentlichung

5. März 2025

Erteilung

5. März 2025

Rechtsraum

EP

IPC

H01L23/31C09K21/06

Abstract

A semiconductor package is described which meets a plurality of predetermined electrical, mechanical, chemical and/or environmental requirements. The semiconductor package includes a semiconductor die embedded in or covered by a molded plastic body, the molded plastic body satisfying only a subset of the plurality of predetermined electrical, mechanical, chemical and/or environmental requirements. The semiconductor package further includes a plurality of terminals protruding from the molded plastic body and electrically connected to the semiconductor die, and a coating applied to at least part of the molded plastic body and/or part of the plurality of terminals. The coating satisfies each predetermined electrical, mechanical, chemical and/or environmental requirement not satisfied by the molded plastic body.

Anmelder

Firma

Infineon Technologies AG

Land

🇩🇪 Deutschland

Fachgebiete