Druckempfindliche Klebstoffzusammensetzungen zur Herstellung Elektronischer Vorrichtungen

Details

Veröffentlichungs-Nr.

EP3339388

Aktenzeichen

EP16206228

Anmeldetag

22. Dezember 2016

Veröffentlichung

26. Januar 2022

Erteilung

26. Januar 2022

Rechtsraum

EP

IPC

C09J7/00C09J11/08

Abstract

The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt%, when measured after exposure to 60°C and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85°C according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

Anmelder

Firma

3M Innovative Properties Company

Land

🇺🇸 USA

Fachgebiete