Verfahren zur Herstellung einer Elektronischen Modulanordnung und Elektronische Modulanordnung

Details

Veröffentlichungs-Nr.

EP3340291

Aktenzeichen

EP16206797

Anmeldetag

23. Dezember 2016

Veröffentlichung

30. Oktober 2024

Erteilung

30. Oktober 2024

Rechtsraum

EP

IPC

H01L23/24H01L23/10H05K1/02H01L23/367H01L23/16H01L23/373// H01L23/053H05K3/28

Abstract

One aspect relates to a method for producing an electronic module assembly. In that method, a curable first mass extending between a substrate assembly and a module housing is cured while a circuit carrier of the substrate assembly comprises at least a first temperature. Between a side wall of the module housing and the substrate assembly, an adhesive connection is formed by curing a curable second mass. Subsequent to curing the first mass, the circuit carrier is cooled down to below a second temperature lower than the first temperature.

Anmelder

Firma

Infineon Technologies AG

Land

🇩🇪 Deutschland

Fachgebiete