Lichtemittierende Vorrichtung und Verfahren zur Herstellung davon

Details

Veröffentlichungs-Nr.

EP3361505

Aktenzeichen

EP18156209

Anmeldetag

12. Februar 2018

Veröffentlichung

30. März 2022

Erteilung

30. März 2022

Rechtsraum

EP

IPC

H01L25/075H01L33/50

Abstract

A method for manufacturing a light emitting device includes: providing a wafer (10) that includes, successively from an upper face side, an electrode structure (17) that includes multilayer wiring, a semiconductor layer (12) electrically connected to the electrode structure, and a growth substrate (11); bonding the wafer (10) to a support substrate, e.g. via bonding layer (60); exposing the semiconductor layer by removing the growth substrate (11) from the wafer (10); separating the semiconductor layer (12) into a plurality of light emitting elements, which comprises forming grooves on a semiconductor layer side surface of the wafer; and forming a phosphor layer having protrusions and recesses at a surface thereof such that the phosphor layer covers surfaces of the light emitting elements, which comprises: forming a coating film on surfaces of the light emitting elements by applying a slurry comprising phosphor particles contained in a solvent, and vaporizing the solvent in the coating film to form the phosphor layer.

Anmelder

Firma

NICHIA CORPORATION

Land

🇯🇵 Japan

Fachgebiete