Strahllötbad und Strahllötvorrichtung

Details

Veröffentlichungs-Nr.

EP3437775

Aktenzeichen

EP18187232

Anmeldetag

3. August 2018

Veröffentlichung

4. Oktober 2023

Erteilung

4. Oktober 2023

Rechtsraum

EP

IPC

B23K1/00B23K1/08B23K1/20B23K3/06B23K3/08// B23K101/42

Abstract

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

Anmelder

Firma

Senju Metal Industry Co., Ltd

Land

🇯🇵 Japan

Fachgebiete