Spulenkomponente
Anmelder: Sumida Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP3448137
- Aktenzeichen
- EP18189697
- Anmeldetag
- 20. August 2018
- Veröffentlichung
- 28. April 2021
- Erteilung
- 28. April 2021
- Rechtsraum
- EP
- IPC
- H05K1/11// H05K3/46H01F17/00H01F27/28H05K1/14H05K1/16
Abstract
For a substrate (31) of a coil component, there are arranged a plurality of through-holes (50); the pattern-wiring (315) is provided with a loop-shaped portion (315a) surrounding the circumference of a center hole (314) which penetrates the substrate (31) a pair of end portions (315b1, 315b2) which extend from that loop-shaped portion (315a); and the neighboring two through-holes (50) within the plurality of through-holes penetrate the substrate (31) in a state that at least a part of each of the openings (HS11, HS12, HS13) thereof superimpose each of the pair of end portions (315b1, 315b2) and is connected electrically with each of the end portions. In addition, the opening of one of the through-holes (HS11, HS12) at one of the end portions within the pair of end portions is provided at a biased position(LP1, LC1) close to the other of the end portions with respect to the center of the one of the end portions in the intersecting-direction.
Anmelder
- Firma
- Sumida Corporation
- Land
- 🇯🇵 Japan
Sumida ist ein japanischer Hersteller elektronischer Bauelemente wie Spulen und Transformatoren mit Sitz in Tokio. Das Patentportfolio konzentriert sich stark auf Halbleiter- und elektrische Bauelemente, ergänzt durch Mess- und Energietechnik. Die Anmeldungen decken den Zeitraum 2001 bis 2025 ab.
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