Modulare Elektronische Vorrichtung und Kopfeinheit für Fahrzeuge

Details

Veröffentlichungs-Nr.

EP3461249

Aktenzeichen

EP18196182

Anmeldetag

24. September 2018

Veröffentlichung

30. Oktober 2024

Erteilung

30. Oktober 2024

Rechtsraum

EP

IPC

H05K7/20H05K9/00H05K5/00

Abstract

The present disclosure relates to electronic devices and configurations. In one embodiment, an electronic device includes a plurality of circuit boards and a plurality of chassis enclosures. Each of the plurality of circuit boards is separately housed by a chassis enclosure. Each chassis enclosure includes a front housing and a back housing, the front housing and back housing configured to retain a circuit board, and at least one heat dissipation element. The plurality of chassis enclosures are mounted to provide an air gap for heat dissipation between each chassis enclosures. Each chassis enclosure electrically shields a retained circuit board.

Anmelder

Firma

Harman International Industries, Incorporated

Land

🇺🇸 USA

Fachgebiete