Anordnungen und Verfahren zur Bereitstellung einer Drahtbondverbindung

Details

Veröffentlichungs-Nr.

EP3550596

Aktenzeichen

EP18165648

Anmeldetag

4. April 2018

Veröffentlichung

4. September 2024

Erteilung

4. September 2024

Rechtsraum

EP

IPC

H01L21/60B23K20/00H01L23/00

Abstract

A method comprises heating a first electrically conductive layer (14) that is to be electrically contacted, and that is arranged on a first element (10), and pressing a first end (22) of a bonding wire (20) on the first electrically conductive layer (14) by exerting pressure to the first end (22) of the bonding wire (20), and further by exposing the first end (22) of the bonding wire (20) to ultrasonic energy, thereby deforming the first end (22) of the bonding wire (20) and creating a permanent substance-to-substance bond between the first end (22) of the bonding wire (20) and the first electrically conductive layer (14). The bonding wire (20) either comprises a rounded cross section with a diameter (d1) of at least 125µm or a rectangular cross section with a first width (w1) of at least 500µm and a first height (h1) of at least 50µm.

Anmelder

Firma

Infineon Technologies AG

Land

🇩🇪 Deutschland

Fachgebiete