Substrat

Details

Veröffentlichungs-Nr.

EP3561822

Aktenzeichen

EP19169371

Anmeldetag

16. April 2019

Veröffentlichung

19. August 2020

Erteilung

19. August 2020

Rechtsraum

EP

IPC

H01F17/06H01F27/28H01F17/00H01F27/30H05K1/02

Abstract

A substrate (1A∼1E) includes a multilayer substrate body (3) in which a plurality of circuit bodies (33) are laminated in a laminating direction through insulating layers (32) and are interlayer connected via a connected conductor (36) formed on each of the insulating layers (32), and a magnetic body (4) that is arranged in the laminating direction while at least a part of or all of the magnetic body (4) sandwiches the circuit bodies (33). Each of the circuit bodies (33) includes at least a first circuit body (33a) and a second circuit body (33d). The first circuit body (33a) is formed of a first extending portion (33aa) and a first folding portion (33ab). The second circuit body (33d) is formed of a second extending portion (33da) and a second folding portion (33db).

Anmelder

Firma

YAZAKI CORPORATION

Land

🇯🇵 Japan

Fachgebiete