Plattierte Metallstrukturen zur Ableitung von Wärme in einer Tragbaren Elektronischen Vorrichtung

Details

Veröffentlichungs-Nr.

EP3579674

Aktenzeichen

EP19176560

Anmeldetag

24. Mai 2019

Veröffentlichung

24. Februar 2021

Erteilung

24. Februar 2021

Rechtsraum

EP

IPC

H05K7/20G06F1/20H04M1/02

Abstract

This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

Anmelder

Firma

Apple Inc.

Land

🇺🇸 USA

Fachgebiete