Lichtempfangselement und Abstandsmessmodul
Anmelder: Sony Semiconductor Solutions Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP3598167
- Aktenzeichen
- EP19185887
- Anmeldetag
- 11. Juli 2019
- Veröffentlichung
- 13. April 2022
- Erteilung
- 13. April 2022
- Rechtsraum
- EP
- IPC
- G01S7/481G01S17/89H01L27/146G01S17/32
Abstract
A light-receiving element includes an on-chip lens; an interconnection layer; and a semiconductor layer that is disposed between the on-chip lens and the interconnection layer. The semiconductor layer includes a first voltage application unit to which a first voltage is applied, a second voltage application unit to which a second voltage different from the first voltage is applied, a first charge detection unit that is disposed at the periphery of the first voltage application unit, a second charge detection unit that is disposed at the periphery of the second voltage application unit, and a charge discharge region that is provided on an outer side of an effective pixel region. For example, the present technology is applicable to a light-receiving element that generates distance information in a ToF method, or the like.
Anmelder
- Firma
- Sony Semiconductor Solutions Corporation
- Land
- 🇯🇵 Japan
Japanisches Halbleiterunternehmen mit Sitz in Atsugi, eine Tochtergesellschaft der Sony Group. Das Unternehmen entwickelt Bildsensoren, CMOS-Sensoren und Halbleiterlösungen für Kameras, Smartphones, Automobile und industrielle Anwendungen.
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