Lichtempfangselement und Abstandsmessmodul

EP3598167 Art B1 13. April 2022

Anmelder: Sony Semiconductor Solutions Corporation 🇯🇵

Details

Veröffentlichungs-Nr.
EP3598167
Aktenzeichen
EP19185887
Anmeldetag
11. Juli 2019
Veröffentlichung
13. April 2022
Erteilung
13. April 2022
Rechtsraum
EP
IPC
G01S7/481G01S17/89H01L27/146G01S17/32
Offizieller Volltext

Abstract

A light-receiving element includes an on-chip lens; an interconnection layer; and a semiconductor layer that is disposed between the on-chip lens and the interconnection layer. The semiconductor layer includes a first voltage application unit to which a first voltage is applied, a second voltage application unit to which a second voltage different from the first voltage is applied, a first charge detection unit that is disposed at the periphery of the first voltage application unit, a second charge detection unit that is disposed at the periphery of the second voltage application unit, and a charge discharge region that is provided on an outer side of an effective pixel region. For example, the present technology is applicable to a light-receiving element that generates distance information in a ToF method, or the like.

Anmelder

Firma
Sony Semiconductor Solutions Corporation
Land
🇯🇵 Japan
🇯🇵 Sony Semiconductor Solutions

Japanisches Halbleiterunternehmen mit Sitz in Atsugi, eine Tochtergesellschaft der Sony Group. Das Unternehmen entwickelt Bildsensoren, CMOS-Sensoren und Halbleiterlösungen für Kameras, Smartphones, Automobile und industrielle Anwendungen.

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