Lichtempfangselement, Entfernungsmessmodul und Elektronische Vorrichtung
Anmelder: Sony Semiconductor Solutions Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP3598499
- Aktenzeichen
- EP19185055
- Anmeldetag
- 8. Juli 2019
- Veröffentlichung
- 11. Mai 2022
- Erteilung
- 11. Mai 2022
- Rechtsraum
- EP
- IPC
- H01L27/146G01S7/481G01S7/4914G01S17/88G01S17/36G01S17/894G01S17/931
Abstract
Disclosed is a light receiving element (1) including an on-chip lens (47), a wiring layer (42), and a semiconductor layer (41) disposed between the on-chip lens and the wiring layer. The semiconductor layer includes a photodiode (PD), a first transfer transistor (TRG1) that transfers electric charge generated in the photodiode to a first charge storage portion (FD1), a second transfer transistor (TRG2) that transfers electric charge generated in the photodiode to a second charge storage portion (FD2), and an interpixel separation portion (61) that separates the semiconductor layers of adjacent pixels from each other, for at least part of the semiconductor layer in the depth direction. The wiring layer has at least one layer including a light blocking member (63). The light blocking member is disposed to overlap with the photodiode in a plan view.
Anmelder
- Firma
- Sony Semiconductor Solutions Corporation
- Land
- 🇯🇵 Japan
Japanisches Halbleiterunternehmen mit Sitz in Atsugi, eine Tochtergesellschaft der Sony Group. Das Unternehmen entwickelt Bildsensoren, CMOS-Sensoren und Halbleiterlösungen für Kameras, Smartphones, Automobile und industrielle Anwendungen.
6.194 Patente in unserer Datenbank