Verbindungsstruktur und Zugehörige Verfahren

Details

Veröffentlichungs-Nr.

EP3629372

Aktenzeichen

EP18197400

Anmeldetag

28. September 2018

Veröffentlichung

16. Juni 2021

Erteilung

16. Juni 2021

Rechtsraum

EP

IPC

H01L23/522H01L21/768

Abstract

According to an aspect of the present inventive concept there is provided an interconnect structure (105) comprising: four interconnection levels including a respective dielectric layer and a set of conductive paths. The interconnect structure further comprises a first multi-level via structure (10) extending from a first interconnection level (100) to a third interconnection level (300) and forming a single unitary body passing through a second interconnection level (200) distant from any of the second set of conductive paths; and a second multi-level via structure (20) extending from the second interconnection level (200) to a fourth interconnection level (400) and forming a single unitary body passing through the third interconnection level (300) distant from any of the third set of conductive paths. There is further provided a method of forming a first multi-level via structure and a second multi-level via structure in an interconnect structure.

Anmelder

Firma

IMEC vzw

Land

🇧🇪 Belgien

Fachgebiete