Leistungselektronikmodul

Details

Veröffentlichungs-Nr.

EP3637461

Aktenzeichen

EP18199846

Anmeldetag

11. Oktober 2018

Veröffentlichung

4. Juni 2025

Erteilung

4. Juni 2025

Rechtsraum

EP

IPC

H01L23/34

Abstract

A power electronic component comprising a surface adapted to be attached to a heatsink, the surface forming a bottom surface of the power electronic component, one or more power electronic semiconductor chips (3) mounted on a substrate (4) above the bottom surface, and a housing (2) enclosing the one or more power electronic semiconductor chips. The power electronic component comprises a thermal insulator (21; 31; 41; 51) disposed above the one or more power electronic semiconductor chips, such that the bottom surface and the thermal insulator (21; 31; 41; 51) are on the opposite sides of the one or more power electronic semiconductor chips (3).

Anmelder

Firma

ABB Schweiz AG

Land

🇨🇭 Schweiz

Fachgebiete