Systeme und Verfahren zur Passiven Erwärmung von Temperaturempfindlichen Elektronischen Komponenten
Anmelder: General Electric Company 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP3648544
- Aktenzeichen
- EP19206173
- Anmeldetag
- 30. Oktober 2019
- Veröffentlichung
- 7. Januar 2026
- Erteilung
- 7. Januar 2026
- Rechtsraum
- EP
- IPC
- H05B1/02
Abstract
A system configured for operation below a threshold temperature system includes a power supply (102), a housing (104), a temperature-sensitive electronic component (106), and a heating circuit (108). The temperature-sensitive electronic component (106) is enclosed within said housing (104) and electrically connected to the power supply (102), wherein the temperature-sensitive electronic component (106) becomes susceptible to failure when the temperature of said temperature-sensitive electronic component (106) decreases and crosses the threshold temperature. The heating circuit (108) is at least partially enclosed within the housing (104) and comprising a temperature-dependent resistor (110), the heating circuit (108) electrically connected to the power supply (102) and configured to generate heat energy within the housing (104) when the temperature within the housing (104) decreases and approaches the threshold temperature in order to maintain the temperature of the temperature-sensitive electronic component (106) above the threshold temperature.
Anmelder
- Firma
- General Electric Company
- Land
- 🇺🇸 USA
US-amerikanischer Technologiekonzern mit Sitz in Massachusetts. Historisch aktiv in Energieerzeugung, Luftfahrttriebwerken, Medizintechnik und Industrietechnik über verschiedene Geschäftsbereiche.
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