Halbleiterbauelement
Anmelder: Infineon Technologies Austria AG 🇦🇹
Details
- Veröffentlichungs-Nr.
- EP3664150
- Aktenzeichen
- EP18210658
- Anmeldetag
- 6. Dezember 2018
- Veröffentlichung
- 2. Juli 2025
- Erteilung
- 2. Juli 2025
- Rechtsraum
- EP
- IPC
- H10D62/10H10D84/82H10D30/60H10D30/83H10D30/67H10D86/00
Abstract
A method comprises forming a layer stack with a plurality of first layers (110) of a first doping type and a plurality of second layers (120) of a second doping type complementary to the first doping type on top of a carrier (200). Forming the layer stack comprises forming a plurality of epitaxial layers (140<sub>n</sub>) on the carrier (200). Forming each of the plurality of epitaxial layers (140<sub>n</sub>) comprises depositing a layer of semiconductor material, forming at least two first implantation regions of one of a first type or a second type at different vertical positions of the respective layer of semiconductor material, and forming at least one second implantation region of a type that is complementary to the type of the first implantation regions, wherein the first implantation regions and the second implantation regions are arranged alternatingly.
Anmelder
- Firma
- Infineon Technologies Austria AG
- Land
- 🇦🇹 Österreich
Österreichische Konzerngesellschaft des deutschen Halbleiterherstellers Infineon mit Sitz in Villach. Entwickelt und fertigt Halbleiterbauelemente für Automobil-, Energie- und Industrieanwendungen.
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Westphal, Mussgnug & Partner Patentanwälte mbB · Villingen-Schwenningen