Sensoreinheit und Verfahren zum Verbinden eines Substrats und eines Trägers

Details

Veröffentlichungs-Nr.

EP3680211

Aktenzeichen

EP19151102

Anmeldetag

10. Januar 2019

Veröffentlichung

6. März 2024

Erteilung

6. März 2024

Rechtsraum

EP

IPC

B81B7/00B81C1/00

Abstract

The present invention relates to a sensor unit and to a corresponding method of assembling such a sensor unit. The sensor unit comprises at least one transducer element (102, 202) for monitoring at least one measurand and generating an electrical output signal correlated with the at least one measurand, and a sensor substrate (104, 204) with a first surface (108, 208) and an opposing second surface (110, 210), said sensor substrate (104, 204) comprising said transducer element (102, 202) and at least one first electrically conductive contact pad (114, 214) arranged on the first surface of the sensor substrate, wherein said first electrically conductive contact pad is electrically connected to the transducer element. A recess (116, 216) is provided in the sensor substrate, the recess extending from the second surface (110, 210) to the first surface (108, 208), wherein said sensor substrate is mounted on a circuit carrier (106, 206) in a way that the first surface faces the circuit carrier. The circuit carrier comprises at least one second electrically conductive pad (118, 218), wherein the first electrically conductive contact pad and the second electrically conductive contact pad are interconnected by an electrically conductive material (124, 224; 126; 226) that is filled in from the second surface towards the first surface of the sensor substrate.

Anmelder

Firma

TE Connectivity Solutions GmbH

Land

🇨🇭 Schweiz