Reifen
Anmelder: SUMITOMO RUBBER INDUSTRIES, LTD. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP3711974
- Aktenzeichen
- EP20158467
- Anmeldetag
- 20. Februar 2020
- Veröffentlichung
- 17. November 2021
- Erteilung
- 17. November 2021
- Rechtsraum
- EP
- IPC
- B60C1/00B60C19/00B60C23/04
Abstract
A tire capable of improving durability and the readability of an electronic component such as an RFID tag in a well-balanced manner is provided. The tire includes: an electronic module including an electronic component and a rubber composition covering the electronic component; and an adjacent rubber member adjacent to the electronic module, a difference in complex elastic modulus E* at 60°C between the rubber composition and the adjacent rubber member is not greater than 2.0 MPa, an amount of carbon black per 100 parts by mass of a rubber component in the rubber composition is 10 to 50 parts by mass, the rubber composition has a volume of 500 to 10000 mm<sup>3</sup>, and the rubber composition has a relative dielectric constant of 7 or less at 915 MHz.
Anmelder
- Firma
- SUMITOMO RUBBER INDUSTRIES, LTD.
- Land
- 🇯🇵 Japan
Japanisches Unternehmen mit Sitz in Kobe, das Reifen unter der Marke Dunlop sowie weitere Gummi- und Kautschukprodukte für Fahrzeuge und Sportartikel entwickelt und produziert.
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