Montagevorrichtung und Verfahren zur Montage von Komponenten

Details

Veröffentlichungs-Nr.

EP3726075

Aktenzeichen

EP20157769

Anmeldetag

17. Februar 2020

Veröffentlichung

30. März 2022

Erteilung

30. März 2022

Rechtsraum

EP

IPC

F16C11/04F16C11/06F16C31/02F16M11/04F16M11/12F16M11/14

Abstract

A mounting device (10) includes a first mount portion (12) and a second mount portion (26). The first mount portion (12) is in communication with a first pin (24) extending along a first axis (22). The second mount portion (26) is in communication with a pair of opposing second pins (38) extending along a second axis (36) different than the first axis (22). The second pins (38) are in rotational communication with and extend outward from the first pin (24). The first and second mount portions (12, 26) are configured to translate along the first and second axes (22, 36) and rotate about the first and second axes (22, 36) with respect to one another.

Anmelder

Firmen

Raytheon Technologies Corporation
United Technologies Corporation

Land

🇺🇸 USA

Fachgebiete