Kühlkörperanordnung, Verfahren zur Herstellung einer Kühlkörperanordnung und Elektrische Vorrichtung

Details

Veröffentlichungs-Nr.

EP3726572

Aktenzeichen

EP19169398

Anmeldetag

16. April 2019

Veröffentlichung

13. August 2025

Erteilung

13. August 2025

Rechtsraum

EP

IPC

H01L23/373

Abstract

A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly comprising a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.

Anmelder

Firma

ABB Schweiz AG

Land

🇨🇭 Schweiz

Fachgebiete