Wärmeleitfähiges Polymer und Komponenten

Details

Veröffentlichungs-Nr.

EP3767007

Aktenzeichen

EP19213107

Anmeldetag

3. Dezember 2019

Veröffentlichung

16. April 2025

Erteilung

16. April 2025

Rechtsraum

EP

IPC

C23C16/455C23C16/04F28D9/00F28D21/00F28F3/06F28F21/04F28F21/06

Abstract

A method of forming a component includes depositing a ceramic material within an open-cell void (206) of a polymer body (200). The ceramic material deposited around the periphery of the open-cell void structure forms a thermally-conductive path (210) through the polymer body. The ceramic material circumscribes an open volume extending the entire length of the thermally-conductive path that is filled with a sealant such that fluids are incommunicable from the first surface (202) to the second surface (204) via the thermally-conductive path. A method of forming a heat exchanger includes forming a plurality of plates, each plate formed as a thermally-conductive polymer body. The method of forming the heat exchanger further includes arranging the plurality of plates within a housing to form a plate and frame heat exchanger configured to place a first flowpath in a heat exchange relationship with a second flowpath.

Anmelder

Firma

Hamilton Sundstrand Corporation

Land

🇺🇸 USA

Fachgebiete