Verbundstruktur und Verfahren zur Herstellung einer Verbundstruktur

Details

Veröffentlichungs-Nr.

EP3789805

Aktenzeichen

EP19195378

Anmeldetag

4. September 2019

Veröffentlichung

9. August 2023

Erteilung

9. August 2023

Rechtsraum

EP

IPC

G02B6/42

Abstract

A bonded structure (1) comprises a substrate component (20) having a plurality of first pads (21) arranged on or within a surface (22) of the substrate component (20), and an integrated circuit component (10) having a plurality of second pads (11) arranged on or within a surface (12) of the integrated circuit component (10). The bonded structure (1) further comprises a plurality of connection elements (31) physically connecting the first pads (21) to the second pads (11). The surface (12) of the integrated circuit component (10) is tilted obliquely to the surface (22) of the substrate component (22) at a tilt angle (α) that results from nominal variations of surface sizes of the first and second pads (21, 11) .

Anmelder

Firma

AMS AG

Land

🇦🇹 Österreich

Fachgebiete