Kühlvorrichtung für Halbleiterschaltelemente, Stromwechselrichtervorrichtung, Anordnung und Herstellungsverfahren

Details

Veröffentlichungs-Nr.

EP3836206

Aktenzeichen

EP19216160

Anmeldetag

13. Dezember 2019

Veröffentlichung

7. Mai 2025

Erteilung

7. Mai 2025

Rechtsraum

EP

IPC

H01L23/473F28F9/02

Abstract

Cooling device (15) for semiconductor switching elements (10, 11), comprising- a first main wall (16) for carrying the semiconductor switching elements (10, 11),- a second main wall (19) being opposite to the first main wall (16),- a cooling channel (20) that is defined by the first main wall (16) and the second main wall (19) and allows a coolant to flow along the main walls (16, 19) in a main flow direction (21),- a first side wall (22) and a second side wall (23) each extending from the first main wall (16), wherein the main flow direction (21) is directed from one of the side walls (22) to the other side wall (23), and- at least one connection channel, which leads into the cooling channel (20) through the second main wall (19),wherein at least one guiding device (26, 29) is arranged within the at least one connection channel and configured to direct the coolant towards an edge (27a, 27b), formed by the first main wall (16) and one of the side walls (22, 23).

Anmelder

Firmen

Valeo eAutomotive Germany GmbH
Valeo Siemens eAutomotive Germany GmbH

Land

🇩🇪 Deutschland

Fachgebiete