Kontrollierte Induzierte Verziehungen von Elektronischen Substraten

Details

Veröffentlichungs-Nr.

EP3855480

Aktenzeichen

EP21153263

Anmeldetag

25. Januar 2021

Veröffentlichung

28. Juli 2021

Rechtsraum

EP

IPC

H01L23/00H01L21/56H01L23/31H01L23/29// H01L21/02

Abstract

An integrated circuit (IC) package incorporating controlled induced warping is disclosed. The IC package includes an electronic substrate (102) having an active side (104) upon which semiconducting dies (100) and functional circuits have been lithographed or otherwise fabricated, leading to an inherent warping in the direction of the active side. One or more corrective layers (112) may be deposited to the opposing, or inactive, side (114) of the semiconducting die via thin film deposition (TFD) instrumentation and techniques in order to induce corrective warping of the electronic substrate back toward the horizontal (e.g., in the direction of the inactive side) to a desired degree.

Anmelder

Firma

Rockwell Collins, Inc.

Land

🇺🇸 USA

Fachgebiete