Leistungshalbleitermodulanordnung

Details

Veröffentlichungs-Nr.

EP3886156

Aktenzeichen

EP20165951

Anmeldetag

26. März 2020

Veröffentlichung

8. Juni 2022

Erteilung

8. Juni 2022

Rechtsraum

EP

IPC

H01L23/34H01L23/24H01L23/053H01L25/07G01K1/14G01K11/32H01L23/498H01L23/00H01L23/373

Abstract

A power semiconductor module arrangement (100) comprises a substrate (10) comprising a dielectric insulation layer (11), and a first metallization layer (111) arranged on a first side of the dielectric insulation layer (11), at least one controllable semiconductor element (20) mounted on the first metallization layer (111) of the substrate (10), and at least one temperature sensor arrangement (80), each of the at least one temperature sensor arrangement (80) comprising an optically sensitive element (802) and an optical cable (806) coupled to the optically sensitive element (802) with a first end.

Anmelder

Firma

Infineon Technologies AG

Land

🇩🇪 Deutschland

Fachgebiete