Elektronische Komponente mit Kühlungsfreiraum und Montageverfahren

Details

Veröffentlichungs-Nr.

EP3941172

Aktenzeichen

EP20186153

Anmeldetag

16. Juli 2020

Veröffentlichung

24. Januar 2024

Erteilung

24. Januar 2024

Rechtsraum

EP

IPC

H05K7/20

Abstract

The present invention relates to an electronic component comprising at least one heat generating electronic element, and to a method of assembling such an electronic component. An electronic component (100) comprises a circuit carrier unit (124), wherein at least one electronic element (146) is assembled on the circuit carrier unit (124), and a protective housing (104) for encompassing the circuit carrier unit (124) at least partly. The circuit carrier unit (124) has a first section (128) and a second section (130), the second section (130) being arranged at a distance from the first section (128) and opposing to the first section (128), wherein the housing (104) has a first receiving portion (142) for receiving the first section (128) and a second receiving portion (144) for receiving the second section (130), and wherein the first receiving portion (142) and the second receiving portion (144) are separated from each other by a cooling clearance (106).

Anmelder

Firmen

TE Connectivity Germany GmbH
TE Connectivity Solutions GmbH
TE Connectivity Services GmbH

Land

🇩🇪 Deutschland

Fachgebiete