Integration eines Thermischen Speichersystems in einer Elektronikkühlung

Details

Veröffentlichungs-Nr.

EP3965543

Aktenzeichen

EP21216568

Anmeldetag

21. Dezember 2021

Veröffentlichung

6. September 2023

Erteilung

6. September 2023

Rechtsraum

EP

IPC

H05K7/20

Abstract

A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop, and a buffer loop. The main loop includes a heat exchanger coupled to the inlet port and the outlet port, and the heat exchanger is to receive fluid from the inlet port, to exchange heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. A buffer loop is coupled to the inlet port and the main loop. The second loop includes a buffer unit and a first valve to control the fluid to flow into the buffer unit for storage and to discharge the fluid from the buffer unit to follow into the main loop for heat exchange. The buffer unit comprises an air section to store air and a buffer section to store a portion of the fluid. The air section is to adjust an air pressure based on a temperature obtained from a temperature sensor disposed on the heat exchanger and a fluid pressure obtained from a pressure sensor disposed near the inlet port.

Anmelder

Firma

Baidu USA LLC

Land

🇺🇸 USA

Fachgebiete