Halbleiterbauelement
Anmelder: Renesas Electronics Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP3989228
- Aktenzeichen
- EP21203908
- Anmeldetag
- 21. Oktober 2021
- Veröffentlichung
- 11. September 2024
- Erteilung
- 11. September 2024
- Rechtsraum
- EP
- IPC
- G11C7/06G11C11/4074G11C11/4091
Abstract
A semiconductor device includes a memory mat having: a plurality of memory cells; a sense amplifier connected to a memory cell selected from the plurality of memory cells; a first power supply wiring; a first switch connected between the sense amplifier and the first power supply wiring and made an ON state in operating the sense amplifier; and a second switch connected to the sense amplifier and made an ON state in operating the sense amplifier, a second power supply wiring arranged outside the memory mat and connected to the first power supply wiring, a third power supply wiring arranged outside the memory mat and connected to the sense amplifier via the second switch, and a short switch arranged outside the memory mat and connected between the second and third power supply wirings. Here, in operating the sense amplifier, the short switch is made an ON state.
Anmelder
- Firma
- Renesas Electronics Corporation
- Land
- 🇯🇵 Japan
Japanischer Halbleiterhersteller mit Sitz in Tokio, spezialisiert auf Mikrocontroller, analoge Bauelemente und Halbleiterlösungen unter anderem für die Automobil- und Industrieelektronik.
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