Leitfähige Wärmeverwaltungsarchitektur für Elektronische Vorrichtungen
Anmelder: Hamilton Sundstrand Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP3996480
- Aktenzeichen
- EP21201934
- Anmeldetag
- 11. Oktober 2021
- Veröffentlichung
- 20. März 2024
- Erteilung
- 20. März 2024
- Rechtsraum
- EP
- IPC
- H05K7/20
Abstract
An electronic assembly includes a first printed wiring board (120a) (PWB) on a first side of the electronic assembly, and a first stiffener (210) secured to the first PWB. The electronic assembly also includes a second PWB (120b) on a second side of the electronic assembly, opposite the first side, a second stiffener (130) secured to the second PWB, and a center stiffener (230) seated in the second stiffener and between the first stiffener and the second stiffener. The center stiffener (230) has a first side facing the first stiffener, a second side that is opposite the first side and facing the second stiffener, a first end, and a second end, opposite the first end. Electronic devices are secured to the center stiffener. The center stiffener (230) dissipates heat from the electronic devices, and the electronic devices include power dies.
Anmelder
- Firma
- Hamilton Sundstrand Corporation
- Land
- 🇺🇸 USA
US-amerikanisches Unternehmen der Luft- und Raumfahrtindustrie, das Flugzeugsysteme wie Umweltkontroll-, Energie- und Antriebssysteme entwickelt; heute Teil von Collins Aerospace innerhalb von RTX.
4.459 Patente in unserer Datenbank