Hybride Gerätebaugruppen und Ihr Herstellungsverfahren

Details

Veröffentlichungs-Nr.

EP3998625

Aktenzeichen

EP21201118

Anmeldetag

6. Oktober 2021

Veröffentlichung

2. November 2022

Rechtsraum

EP

IPC

H01L21/60H01L23/13H01L23/367H01L23/538H01L25/065H01L25/18H01L29/06H01L25/16// H01L23/552H01L23/14H01L23/498

Abstract

A device assembly includes a functional substrate (32) having one or more electronic components (34) formed there. The functional substrate has a cavity (40) extending from a first surface toward a second surface of the functional substrate at a location that lacks the electronic components. The device assembly further includes a semiconductor die (42) placed within the cavity with a pad surface (44) of the semiconductor die being opposite to a bottom of the cavity. The functional substrate may be formed utilizing a first fabrication technology and the semiconductor die may be formed utilizing a second fabrication technology that differs from the first fabrication technology.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA

Fachgebiete