Halbleiterstruktur

Details

Veröffentlichungs-Nr.

EP4033525

Aktenzeichen

EP21206419

Anmeldetag

4. November 2021

Veröffentlichung

2. August 2023

Rechtsraum

EP

IPC

H01L23/485H01L23/00// H01L23/31

Abstract

A semiconductor structure (1) includes a substrate (100), a passivation layer (110) on the substrate (100), a post-passivation interconnect, PPI, structure on the passivation layer (110), and a polymer layer (130) covering the PPI structure (120) and the passivation layer (110). The PPI structure (120) includes a step structure (125) disposed on the passivation layer (110) and around a lower edge of the PPI structure (120).

Anmelder

Firma

MEDIATEK INC.

Land

🇹🇼 Taiwan

Fachgebiete