Flexible Leiterplatte und Verfahren zur Herstellung einer Flexiblen Leiterplatte

Details

Veröffentlichungs-Nr.

EP4048036

Aktenzeichen

EP22151516

Anmeldetag

14. Januar 2022

Veröffentlichung

9. August 2023

Erteilung

9. August 2023

Rechtsraum

EP

IPC

H05K1/02H05K3/28

Abstract

An objective of the present invention is to prevent a copper foil used as a recognition mark from being stripped from a base film in a flexible printed board while preventing the recognition accuracy for the recognition mark from being reduced. A flexible printed board includes a base film; a copper foil pattern on the base film, wherein the copper foil pattern has a hollow shape with an outer circumferential section and an inner circumferential section and is configured to function as a recognition mark; a coverlay having an opening formed therein, wherein the coverlay is bonded to the base film and covers the outer circumferential section of the copper foil pattern such that an edge of the opening is positioned between the outer circumferential section and the inner circumferential section of the copper foil pattern.

Anmelder

Firma

Yazaki Corporation

Land

🇯🇵 Japan

Fachgebiete