Kühlung eines Wärmeschilds für Clamshell-Bga-Rework

Details

Veröffentlichungs-Nr.

EP4059647

Aktenzeichen

EP21182875

Anmeldetag

30. Juni 2021

Veröffentlichung

9. April 2025

Erteilung

9. April 2025

Rechtsraum

EP

IPC

B23K1/00B23K1/018B23K3/08H01L23/00H05K13/04

Abstract

The present disclosure provides for a heatshield that can be actively cooled during a rework process. The heatshield may include a backer plate, a metal plate, and/or a package pedestal. The backer plate may include one or more air inlet ports configured to be connected to an air compressor. Air inlet ducts may extend from the air inlet ports through at least a portion of the backer plate. A plurality of vents may extend from the air inlet ducts to a top surface of the backer plate such that the plurality of vents directs cooling gas forced into the heatshield towards the metal plate and a first BGA. The cooling gas may maintain the solder joint temperature of the first BGA package below the reflow temperature and below the solidus temperature of the solder joints to prevent reflow-related solder joint defects from occurring in the first BGA package during rework of a second BGA package.

Anmelder

Firma

Google LLC

Land

🇺🇸 USA

Fachgebiete