Bondpads für Halbleiterchips und Zugehörige Verfahren und Systeme

Details

Veröffentlichungs-Nr.

EP4135020

Aktenzeichen

EP22189871

Anmeldetag

11. August 2022

Veröffentlichung

26. Juli 2023

Rechtsraum

EP

IPC

H01L23/00

Abstract

Bond pads for semiconductor die assemblies, and associated methods and systems are disclosed. In one embodiment, a semiconductor die assembly includes a first semiconductor die including a first bond pad on a first side of the first semiconductor die. The semiconductor die assembly further includes a second semiconductor die including a second bond pad on a second side of the second semiconductor die. The first bond pad is aligned and bonded to the second bond pad at a bonding interface between the first and second bond pads, and at least one of the first and second bond pads include a first metal and a second metal different than the first metal. Further, the first metal is located at the bonding interface and the second metal has a first thickness corresponding to at least onefourth of a second thickness of the first or second bond pad.

Anmelder

Firma

Micron Technology, Inc.

Land

🇺🇸 USA

Fachgebiete