Leistungselektronikmodul und Verfahren zu dessen Herstellung

Details

Veröffentlichungs-Nr.

EP4227995

Aktenzeichen

EP22155917

Anmeldetag

9. Februar 2022

Veröffentlichung

11. September 2024

Erteilung

11. September 2024

Rechtsraum

EP

IPC

H01L25/07H01L25/18H01L23/00H01L25/00H01L21/50

Abstract

The present disclosure relates to a power electronics module (10) comprising: a substrate (11) with at least a first metallization area (12), a first group of power electronic devices (14) arranged in the first metallization area (12), wherein the first group comprises a plurality of power electronic devices (14). The power electronics module (10) further comprises a common, uninterrupted joining layer (13) arranged between the first metallization area (12) and the first group of power electronic devices (14), wherein the common, uninterrupted joining layer (13) establishes at least a mechanical and an electrical contact between the first metallization area (12) and the first group of power electronic devices (14).The present disclosure further relates to a method for manufacturing such a power electronics module (10).

Anmelder

Firmen

Hitachi Energy Ltd
Hitachi Energy Switzerland AG

Land

🇨🇭 Schweiz

Fachgebiete