Tauchkühlvorrichtung
Anmelder: NEC Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4243584
- Aktenzeichen
- EP22175962
- Anmeldetag
- 28. Mai 2022
- Veröffentlichung
- 13. September 2023
- Rechtsraum
- EP
- IPC
- H05K7/20
Abstract
An immersion cooling apparatus includes a pressure vessel including a vessel body and at least one lid. The at least one lid is detachably joined to the vessel body, wherein a certain lid of the at least one lid has a coolant outlet and a coolant inlet. The pressure vessel is filled with liquid coolant. A mounting member places the circuit board at a position between the coolant outlet and the coolant inlet within the pressure vessel. The circuit board is immersed in the liquid coolant within the pressure vessel such the circuit board is surrounded with the liquid coolant. The liquid coolant forcedly flows from one side of the circuit board to outside through the coolant outlet and forcedly flows into the other side of the circuit board from outside through the coolant inlet.
Anmelder
- Firma
- NEC Corporation
- Land
- 🇯🇵 Japan
Japanischer Technologiekonzern mit Sitz in Tokio, der IT- und Netzwerklösungen, Telekommunikationsausrüstung sowie Sicherheits- und Biometrietechnik anbietet.
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